MICROELECTRONICS TECHNOLOGY:

• Device characterization and modeling.

• Device physics and novel structures.

• Materials and material characterization techniques.

• Process technology, CMOS, BJT, BiCMOS, GaAs.

• Reliability and failure analysis.

• Radiation effects.

• Packaging, surface mount technology.

• Opto-electronics.

• MEMs and MOEMs Devices.

• Smart power and sensors.

DESIGN AND APPLICATION OF INTEGRATED CIRCUITS AND SYSTEMS:

• Custom and semi-custom circuits (design concepts, architectures and high-performance and low-power circuits).

• Embedded system design.

• Systems on Chip (SoCs).

• Digital signal and data processing.

• Analog circuit techniques.

• Design for testability.

• Low-voltage, low-power VLSI design.

• Applications to computer and telecommunications systems.

• ANN applications.

• Wireless Communication Applications.

COMPUTER-AIDED DESIGN FOR MICROELECTRONICS:

• Simulation (process, device, circuit, logic, timing, functional).

• Layout (placement, routing, floorplanning, symbolic, ERC, DRC).

• Test (generation, testability, build-in test, simulation).

• Systems (design synthesis, compilation, expert systems, tool integration, hardware acceleration, CAD systems).

• Formal verification.

Important Dates

- August 7, 2011

Paper Submission

- September 28, 2011 :
 Acceptance Notification

- October 18, 2011
  Final Submission

- November 10, 2011:
    Registration

- December 19-22:
    ICM 2011